Sputter device including a film forming roller and a plurality of film forming chambers

A sputter device 1 of the present invention, which includes a film forming roller 27 and a plurality of film forming chambers 51, 61, 65, 71, and 75. The plurality of film forming chambers 51, 61, 65, 71, and 75 are respectively provided with a target unit 55 and wall portions 52, 62, 66, 72, and 76...

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Bibliographische Detailangaben
Hauptverfasser:	MURAKAMI, NAOFUMI, KIRA, RYUUICHI, KOMARU, TSUYOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONVEYING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PACKING PERFORMING OPERATIONS SEMICONDUCTOR DEVICES STORING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A sputter device 1 of the present invention, which includes a film forming roller 27 and a plurality of film forming chambers 51, 61, 65, 71, and 75. The plurality of film forming chambers 51, 61, 65, 71, and 75 are respectively provided with a target unit 55 and wall portions 52, 62, 66, 72, and 76 for dividing the film forming chambers. The wall portions 52, 62, 66, 72, and 76 are provided with exhaust ports 15. In a first cross-sectional view, the target unit 55 is arranged on a first imaginary line L1 passing through the center C1 of the film forming roller 27 and the center C2 of the exhaust ports 15.