Sensor package structure and sensing module thereof

The present disclosure provides a sensor package structure and a sensing module thereof. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the li...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, CHIENN, PENG, CHEN-PIN, CHEN, JIAN-RU, HUNG, LIUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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