Sensor package structure and sensing module thereof

The present disclosure provides a sensor package structure and a sensing module thereof. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer includes an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a horizontal direction parallel to a top surface of the sensor chip, the outer lateral side of the light-curing layer is separated from an outer edge of the shielding layer by a second distance, and the second distance is within a range of 1/2 - 1/3 of the first distance. Accordingly, the sensor package structure of the present disclosure can be provided by forming the shielding layer at a specific position, thereby redu