Reflow apparatus and bonding method

Provided is a reflow apparatus used for bonding integrated circuits (ICs) including a main chamber. The main chamber includes a first region, a second region, and a third region. The first region is configured to perform a heat treatment on the ICs. The second region includes a press head which perf...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG, YING-JUI, LIANG, HSIAOUNG, HWANG, CHIEN-LING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided is a reflow apparatus used for bonding integrated circuits (ICs) including a main chamber. The main chamber includes a first region, a second region, and a third region. The first region is configured to perform a heat treatment on the ICs. The second region includes a press head which performs a press treatment on the ICs, so that a curved surface of the ICs becomes a flat surface. The press head includes a body portion and a buffer layer at a side of the body portion. The buffer layer is elastic to conformally attach onto the ICs. The third region is configured to perform a cooling treatment on the ICs.