Thermal processing apparatus and thermal processing method

Provided is a heat processing apparatus in which a heat processing plate has a mounting surface. A plurality of supports are provided on the mounting surface so as to be able to support a lower surface of a substrate. The heat processing plate is further provided with a heating body. The heating bod...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GOTO, SHIGEHIRO, SUENAGA, SATORU, HAYASHI, MEGUMI, FURUKAWA, MASAAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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