Thermal processing apparatus and thermal processing method

Provided is a heat processing apparatus in which a heat processing plate has a mounting surface. A plurality of supports are provided on the mounting surface so as to be able to support a lower surface of a substrate. The heat processing plate is further provided with a heating body. The heating bod...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GOTO, SHIGEHIRO, SUENAGA, SATORU, HAYASHI, MEGUMI, FURUKAWA, MASAAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a heat processing apparatus in which a heat processing plate has a mounting surface. A plurality of supports are provided on the mounting surface so as to be able to support a lower surface of a substrate. The heat processing plate is further provided with a heating body. The heating body subjects the substrate being supported over the mounting surface to heat processing. A gas in a support space between the substrate being supported over the mounting surface and the mounting surface is suctioned by a suctioning device. At this time, the pressure in the support space is detected by a pressure sensor, and a substrate support state is determined on the basis of the detected pressure. The suctioning by the suctioning device is stopped from a point of time at which a predetermined period has elapsed from the beginning of the heat processing of the substrate to the end of the heat processing.