Substrate drying chamber
The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lowe...
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creator | SHIN, YONG-SHIK |
description | The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l |
format | Patent |
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The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201101&DB=EPODOC&CC=TW&NR=202040074A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201101&DB=EPODOC&CC=TW&NR=202040074A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIN, YONG-SHIK</creatorcontrib><title>Substrate drying chamber</title><description>The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAILk0qLilKLElVSCmqzMxLV0jOSMxNSi3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkYGJgYG5iaOxsSoAQADgCJ1</recordid><startdate>20201101</startdate><enddate>20201101</enddate><creator>SHIN, YONG-SHIK</creator><scope>EVB</scope></search><sort><creationdate>20201101</creationdate><title>Substrate drying chamber</title><author>SHIN, YONG-SHIK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202040074A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIN, YONG-SHIK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIN, YONG-SHIK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate drying chamber</title><date>2020-11-01</date><risdate>2020</risdate><abstract>The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
title | Substrate drying chamber |
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