Substrate drying chamber

The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lowe...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SHIN, YONG-SHIK
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SHIN, YONG-SHIK
description The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202040074A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202040074A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202040074A3</originalsourceid><addsrcrecordid>eNrjZJAILk0qLilKLElVSCmqzMxLV0jOSMxNSi3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkYGJgYG5iaOxsSoAQADgCJ1</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate drying chamber</title><source>esp@cenet</source><creator>SHIN, YONG-SHIK</creator><creatorcontrib>SHIN, YONG-SHIK</creatorcontrib><description>The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202040074A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201101&amp;DB=EPODOC&amp;CC=TW&amp;NR=202040074A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIN, YONG-SHIK</creatorcontrib><title>Substrate drying chamber</title><description>The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAILk0qLilKLElVSCmqzMxLV0jOSMxNSi3iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxIeFGBkYGJgYG5iaOxsSoAQADgCJ1</recordid><startdate>20201101</startdate><enddate>20201101</enddate><creator>SHIN, YONG-SHIK</creator><scope>EVB</scope></search><sort><creationdate>20201101</creationdate><title>Substrate drying chamber</title><author>SHIN, YONG-SHIK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202040074A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIN, YONG-SHIK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIN, YONG-SHIK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate drying chamber</title><date>2020-11-01</date><risdate>2020</risdate><abstract>The present invention relates to a substrate drying chamber. The substrate drying chamber includes an upper housing, a lower housing, a sealing part provided on a coupling surface of the lower housing and the upper housing, a substrate placement plate which is coupled to a bottom surface of the lower housing and on which a substrate, on which a pattern wetted with an organic solvent is formed, is disposed, an upper supply port formed in a central region of the upper housing to be directed to the substrate placement plate and configured to provide a supply path of the supercritical fluid for drying, an integrated supply/discharge port formed in the lower housing and configured to provide a supply path of a supercritical fluid for initial pressurization and a discharge path of a mixed fluid in which the organic solvent is dissolved in the supercritical fluid for drying after drying of the substrate according to a supply of the supercritical fluid for drying, and a foreign material discharge part formed in the l</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202040074A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
BLASTING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
SEMICONDUCTOR DEVICES
WEAPONS
title Substrate drying chamber
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T02%3A21%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SHIN,%20YONG-SHIK&rft.date=2020-11-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202040074A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true