Gold-coated silver bonding wire, method for producing same, semiconductor apparatus, and method for producing same

Provided is a gold-coated silver bonding wire which can suppress a short circuit based on ionic migration between ball compression units. A gold-coated silver bonding wire 1 is provided to a core material 2 containing silver as a main component, and the surface of the core material 2, and has a coat...

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Bibliographische Detailangaben
Hauptverfasser:	KAWANO, SHOTA, SAKITA, YUSUKE, ANTOKU, YUKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided is a gold-coated silver bonding wire which can suppress a short circuit based on ionic migration between ball compression units. A gold-coated silver bonding wire 1 is provided to a core material 2 containing silver as a main component, and the surface of the core material 2, and has a coating layer 3 containing gold as a main component. The gold-coated silver bonding wire 1 contains gold in the range of 2-7 mass% with respect to the total amount of the wire, and includes at least one sulfur group element selected from among sulfur, selenium, and tellurium, in the range of 1-80 mass ppm.