Composition and metal-insulating coating material

This composition contains a solvent and a polyimide resin precursor and/or a polyimide resin. The polyimide resin precursor and/or polyimide resin contain a compound represented by formula (0) and/or a compound represented by formula (0') and a compound having a functional group that reacts wit...

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Bibliographische Detailangaben
Hauptverfasser:	ECHIGO, YU, AOKI, DAI, SUGIYAMA, JIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	This composition contains a solvent and a polyimide resin precursor and/or a polyimide resin. The polyimide resin precursor and/or polyimide resin contain a compound represented by formula (0) and/or a compound represented by formula (0') and a compound having a functional group that reacts with a terminal cyclized product of the compound represented by formula (0) and/or compound represented by formula (0'). In formula (0) and formula (0'), R' moieties each independently denote a hydrogen atom or an alkyl group. Ra denotes a tetracarboxylic acid residue. Rb denotes a diamine residue. Ra and/or Rb have one linking group having an active hydrogen and/or 1-4 substituent groups having an active hydrogen. p and q denote arbitrary integers.