Plating chuck capable of maintaining electroplating evenness for the gap region of the substrate

The present invention discloses a plating chuck for retaining a substrate in a plating process. The substrate includes a gap region and a graph region adjacent to the gap region. The plating chuck includes a cover plate which is configured to cover the gap region of the substrate. When the substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JIA, ZHAO-WEI, WANG, HUI, YANG, HONGAO, WANG, JIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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