Plating chuck capable of maintaining electroplating evenness for the gap region of the substrate

The present invention discloses a plating chuck for retaining a substrate in a plating process. The substrate includes a gap region and a graph region adjacent to the gap region. The plating chuck includes a cover plate which is configured to cover the gap region of the substrate. When the substrate is plated, an electric field in the gap region is shielded. Moreover, the portion covered by the cover plate is adjacent to the graph region of the substrate, and the plating chuck further includes a protection shield having a bottom wall upward extended therefrom a side wall having a top outward extended therefrom a top wall, wherein the bottom wall protrudes horizontally to form the cover plate.