Hot dip plating method

Provided is a hot dip plating method with which the adhesion of the plating on the surface of a metal material after applying hot dip plating is favorable and it is possible to reduce energy consumption compared to the past. The hot dip plating method comprises: a film thickness-adjusting step for p...

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Bibliographische Detailangaben
Hauptverfasser:	KOGA, SHINICHI, MIONO, TADAAKI, KAMOSHIDA, SHINICHI, HATTORI, YASUNORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a hot dip plating method with which the adhesion of the plating on the surface of a metal material after applying hot dip plating is favorable and it is possible to reduce energy consumption compared to the past. The hot dip plating method comprises: a film thickness-adjusting step for performing a pre-treatment to adjust the thickness of an oxide film of a metal material; and a plating step for imparting vibrations so that the ratio of the average value (excluding noise) of the sound pressure between sound pressure peaks at a harmonic frequency of the basic frequency with respect to the average value (excluding noise) of the sound pressure of the entire measurement frequency band in an acoustic spectrum is greater than 0.2.