Adhesive composition, optical film comprising same, organic electronic device comprising same and display device

The present application relates to an adhesive composition comprising a first (meta)acrylate resin and a second (meta)acrylate resin, wherein the melting temperature(Tm) of the second (meta)acrylate resin is 20 DEG C higher than the glass transition temperature(Tg) of the first (meta)acrylate resin,...

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Hauptverfasser: LEE, SANG-JIN, HWANG, KYU-SEOK, RYU, DONG-HWAN, JUNG, SAY-YOUNG, LEE, JOO-WON, LEE, DAE-HYUCK
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creator LEE, SANG-JIN
HWANG, KYU-SEOK
RYU, DONG-HWAN
JUNG, SAY-YOUNG
LEE, JOO-WON
LEE, DAE-HYUCK
description The present application relates to an adhesive composition comprising a first (meta)acrylate resin and a second (meta)acrylate resin, wherein the melting temperature(Tm) of the second (meta)acrylate resin is 20 DEG C higher than the glass transition temperature(Tg) of the first (meta)acrylate resin, an optical film comprising same, an organic electronic device comprising same and a display device.
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CALCULATING
CHEMISTRY
COMPUTING
COUNTING
DYES
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PAINTS
PHYSICS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
title Adhesive composition, optical film comprising same, organic electronic device comprising same and display device
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