Adhesive composition, optical film comprising same, organic electronic device comprising same and display device

The present application relates to an adhesive composition comprising a first (meta)acrylate resin and a second (meta)acrylate resin, wherein the melting temperature(Tm) of the second (meta)acrylate resin is 20 DEG C higher than the glass transition temperature(Tg) of the first (meta)acrylate resin,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LEE, SANG-JIN, HWANG, KYU-SEOK, RYU, DONG-HWAN, JUNG, SAY-YOUNG, LEE, JOO-WON, LEE, DAE-HYUCK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CALCULATING CHEMISTRY COMPUTING COUNTING DYES ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PAINTS PHYSICS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present application relates to an adhesive composition comprising a first (meta)acrylate resin and a second (meta)acrylate resin, wherein the melting temperature(Tm) of the second (meta)acrylate resin is 20 DEG C higher than the glass transition temperature(Tg) of the first (meta)acrylate resin, an optical film comprising same, an organic electronic device comprising same and a display device.