Integrated circuit, package structure, and manufacturing method
An integrated circuit is provided herein, which includes a first power transistor, a second power transistor, and an isolator. The first power transistor is integrated with a first driving circuit. The second power transistor is integrated with a second driving circuit. The isolator provides, accord...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | An integrated circuit is provided herein, which includes a first power transistor, a second power transistor, and an isolator. The first power transistor is integrated with a first driving circuit. The second power transistor is integrated with a second driving circuit. The isolator provides, according to an input signal, a first control signal to the first power transistor and provides a second control signal the second power transistor. |
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