Hot-dip plating method

Provided is a hot-dip plating method whereby good plating wettability of a metal material and a hot-dip plating bath is obtained, and energy consumption can be reduced relative to the prior art. In a plating step included in this hot-dip plating method, vibration is applied in a hot-dip plating bath...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOGA, SHINICHI, MIONO, TADAAKI, KAMOSHIDA, SHINICHI, HATTORI, YASUNORI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	Provided is a hot-dip plating method whereby good plating wettability of a metal material and a hot-dip plating bath is obtained, and energy consumption can be reduced relative to the prior art. In a plating step included in this hot-dip plating method, vibration is applied in a hot-dip plating bath so that the ratio of the average value (excluding noise) of the sound pressure between peaks in the sound pressure at a harmonic frequency of the fundamental frequency to the average value (excluding noise) of the sound pressure of the entire measurement frequency band in an acoustic spectrum is greater than 0.2.