Adhesive composition using imide bond-containing resin and phosphorous compound

Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having...

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Bibliographische Detailangaben
Hauptverfasser:	KOYANAGI, HIDEYUKI, KANDA, RYOSUKE, KAWAKUSU, TETSUO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure.