One-component type slurry composition and method of chemical mechanical polishing using same

The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, the one-component polishing slurry composition comprising: abrasive particles; and a polishing selectivity regulator, wherein the polishing selectivity regulator pr...

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Bibliographische Detailangaben
Hauptverfasser:	KONG, HYUN-GOO, HWANG, JIN-SOOK, HWANG, IN-SEOL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a one-component polishing slurry composition and a polishing method using same and, more specifically, the one-component polishing slurry composition comprising: abrasive particles; and a polishing selectivity regulator, wherein the polishing selectivity regulator provides a change in the polishing selectivity of non-Prestonian behavior according to polishing pressure.