Liquid epoxy resin composition for encapsulation and electronic component device

A liquid epoxy resin composition for encapsulation, comprising an epoxy resin, a curing agent and particles having a core-shell structure, the particles having a core that includes a cross-linked polysiloxane and a shell that includes a polymer in which a content of a structural unit having an epoxy...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KUNIMI, MAKOTO, NOJIRI, NAOYUKI, HORI, KOHJI, TAKAHASHI, HISATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A liquid epoxy resin composition for encapsulation, comprising an epoxy resin, a curing agent and particles having a core-shell structure, the particles having a core that includes a cross-linked polysiloxane and a shell that includes a polymer in which a content of a structural unit having an epoxy group is 10% by mass or more.