Sensor and package assembly thereof

The present invention discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHANG, KEN GENG-JIA, CHUANG, WALLACE XIN-YI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention discloses a package assembly of a sensor, comprising: a redistribution layer having a first face and a second face that are opposite to each other, and a first via that penetrates the first face and the second face; a first die electrically connected to the first face of the redistribution layer; a sensing element electrically connected to the first face of the redistribution layer; a cover body located between the redistribution layer and the sensing element, wherein the cover body has a second via that penetrates the cover body, and the second via communicates with the first via; and a molding compound comprising a third face and a fourth face that are opposite to each other, wherein the molding compound encapsulates the first die and the sensing element on the side of the first face of the redistribution layer, and the third face of the molding compound is combined with the first face of the redistribution layer. The package assembly of the sensor allows more components to be packaged