Electronic device package structure and method for fabricating the same

Electronic device package structure and method for fabricating the same

The disclosure provides an electronic device package structure and a method for fabricating the same. The electronic device package structure includes a first electronic element layer, a second electronic element layer, and a filling layer disposed between the first electronic element layer and the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHENG, WEI-YUAN, YANG, CHEN-TSAI, CHUANG, JUIANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The disclosure provides an electronic device package structure and a method for fabricating the same. The electronic device package structure includes a first electronic element layer, a second electronic element layer, and a filling layer disposed between the first electronic element layer and the second electronic element layer, wherein the Young's modulus of the second electronic element layer is less than or equal to the Young's modulus of the first electronic element layer, and the Young's modulus of the filling layer is smaller than the Young's modulus of the second electronic element layer, and the ratio of the Young's modulus of the first electronic element layer to the Young's modulus of the filling layer is 10-1900 and the ratio of the Young's modulus of the second electronic element layer to the Young's modulus of the filling layer is 7.6-1300.