Photosensitive resin composition, photo resist, display device and method of low temperature curing photosensitive resin composition

The present application provides a photosensitive resin composition comprising a binder with an epoxy group and an additive with a thiol group and a siloxane, a photoresist, a display device and a low temperature curing method of the photosensitive resin composition.

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Bibliographische Detailangaben
Hauptverfasser:	KWON, OH-TAK, LEE, SOO-HEE, CHOI, A-NAM, NOH, BYEONG-IL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present application provides a photosensitive resin composition comprising a binder with an epoxy group and an additive with a thiol group and a siloxane, a photoresist, a display device and a low temperature curing method of the photosensitive resin composition.