Wafer dividing apparatus

A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line, comprising: a cassette table on which a cassette that accommodates a plurality of wafers each stuck to an adhesive tape and supporte...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII, YUHEI, INAKAZU, SUSUMU, TAKESUE, NAOYA, MASADA, TAKAYUKI, KAWAGUCHI, YOSHIHIRO, SAITO, RYOTA, MATSUDA, TOMOHITO, ISHIDA, HIDEAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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