Wafer dividing apparatus

A wafer dividing apparatus for dividing a wafer stuck to an adhesive tape and supported at an opening of a frame into individual chips along a scheduled division line, comprising: a cassette table on which a cassette that accommodates a plurality of wafers each stuck to an adhesive tape and supported at an opening of a frame is placed and which is movable upwardly and downwardly in a Z axis direction; a first carry-out/in unit to carry out the frame from the cassette placed on the cassette table or carry in the frame to the cassette; a first temporary receiving unit including a pair of first guide rails the extend in the X axis direction and configured to support the frame carried in by the first carry-out/in unit and a guide rail opening/closing portion configured to increase a distance; a reversing unit including a holding portion configured to hold the frame and configured to rotate by 180 degrees to reverse front and back of the frame; a transport unit configured to move the reversed frame; a second tempo