Heat exchanger for semiconductor components
The present invention relates to a heat exchanger, comprising a heat exchange area, wherein at least one sensor is embedded into the heat exchanger.
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The present invention relates to a heat exchanger, comprising a heat exchange area, wherein at least one sensor is embedded into the heat exchanger. |
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