Tape for processing wafer

A tape for processing a wafer, according to one embodiment of the present invention, comprises: a main body part; and an upper peeling part, wherein the main body part includes an adhesive layer and a substrate layer including pigment, and the upper peeling part includes an upper peeling adhesive la...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	NA, BYOUNG-SOUN, JEON, SEONG-HO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A tape for processing a wafer, according to one embodiment of the present invention, comprises: a main body part; and an upper peeling part, wherein the main body part includes an adhesive layer and a substrate layer including pigment, and the upper peeling part includes an upper peeling adhesive layer and an upper peeling substrate layer, and wherein adhesive power of the adhesive layer can be enhanced by heat treatment.