Multiple zone pad conditioning disk

Multiple zone pad conditioning disk

A pad conditioning disk configured to condition a polishing pad of a chemical mechanical polishing tool including a plurality of zones comprising cutting elements that selectively engage the polishing pad based on positioning of the plurality of zones, is provided. An associated chemical mechanical...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TSAI, STAN D, TSAI, LUKE S
Format: Patent
Sprache:chi ; eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A pad conditioning disk configured to condition a polishing pad of a chemical mechanical polishing tool including a plurality of zones comprising cutting elements that selectively engage the polishing pad based on positioning of the plurality of zones, is provided. An associated chemical mechanical polishing (CMP) tool and method for conditioning a polishing pad during a chemical mechanical polishing process is also provided.