Substrate processing method and substrate processing apparatus

A substrate processing method which processes a substrate with use of a substrate processing apparatus that comprises a COR module for performing a COR treatment on the substrate, a heating module for performing a heat treatment on the substrate, and a cooling module for performing a cooling treatment on the substrate, and which comprises: a COR treatment step for performing a COR treatment on the substrate in a reduced pressure atmosphere by means of the COR module; a subsequent heat treatment step for carrying the substrate to the heating module and performing a heat treatment on the substrate in a reduced pressure atmosphere by means of the heating module; and a subsequent cooling step for carrying the substrate to the cooling module and performing a cooling treatment on the substrate in the atmosphere by means of the cooling module. With respect to this substrate processing method, a treatment cycle which comprises the COR treatment, the heat treatment and the cooling treatment is repeatedly performed on