Method for treating substrate and rinsing liquid

Provided are a method for treating a substrate, including rinsing a surface of a substrate in which a pattern having an aspect ratio of 10 or more is provided on the surface with a rinsing liquid, in which the rinsing liquid includes an organic solvent (S1) having a vapor pressure at 20 DEG C of 25...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAMIKI, TAKUMI, MORI, DAIJIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FATTY ACIDS THEREFROM METALLURGY RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	Provided are a method for treating a substrate, including rinsing a surface of a substrate in which a pattern having an aspect ratio of 10 or more is provided on the surface with a rinsing liquid, in which the rinsing liquid includes an organic solvent (S1) having a vapor pressure at 20 DEG C of 25 mmHg or less; and a rinsing liquid for rinsing the surface of the substrate in which a pattern having an aspect ratio of 10 or more is provided on the surface, including an organic solvent (S1) having a vapor pressure at 20 DEG C of 25 mmHg or less.