Resin composition and its prepared product used for preparing prepreg, resin film, resin film with copper foil, laminate board or printed circuit board
The invention discloses a resin composition and its prepared product. The resin composition includes: a first vinyl-containing polyphenylene ether resin, its prepolymer, or both; and a second vinyl-containing polyphenylene ether resin or its prepolymer; wherein the number average molecular weight of...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention discloses a resin composition and its prepared product. The resin composition includes: a first vinyl-containing polyphenylene ether resin, its prepolymer, or both; and a second vinyl-containing polyphenylene ether resin or its prepolymer; wherein the number average molecular weight of the first vinyl-containing polyphenylene ether resin ranges from 500 to 1500, and the number average molecular weight of the second vinyl-containing polyphenylene ether resin ranges from 1600 to 3500. |
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