Wiring fixing structure and processing apparatus

Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having thr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ABE, JUNICHI, NAKAO, HIROTO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ABE, JUNICHI
NAKAO, HIROTO
description Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having through-holes penetrating in a plate thickness direction are arranged in parallel at predetermined intervals; a first insulation member including multiple first holding portions where convex portions that can be fitted into the through-holes are formed, a first connecting portion connecting the multiple first holding portions at the predetermined intervals, and leg portions extended from the first connecting portion to be parallel to the first holding portions and fixed to the metal surface; and a second insulation member including multiple second holding portions gripping and holding the conductor plates in cooperation with the multiple first holding portions, respectively, and a second connecting portion connecting
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202013829A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202013829A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202013829A3</originalsourceid><addsrcrecordid>eNrjZDAIzyzKzEtXSMusAFHFJUWlySWlRakKiXkpCgVF-cmpxcUgicSCgsSixJLSYh4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEh8SbmRgZGBobGFk6WhMjBoAowAsCA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wiring fixing structure and processing apparatus</title><source>esp@cenet</source><creator>ABE, JUNICHI ; NAKAO, HIROTO</creator><creatorcontrib>ABE, JUNICHI ; NAKAO, HIROTO</creatorcontrib><description>Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having through-holes penetrating in a plate thickness direction are arranged in parallel at predetermined intervals; a first insulation member including multiple first holding portions where convex portions that can be fitted into the through-holes are formed, a first connecting portion connecting the multiple first holding portions at the predetermined intervals, and leg portions extended from the first connecting portion to be parallel to the first holding portions and fixed to the metal surface; and a second insulation member including multiple second holding portions gripping and holding the conductor plates in cooperation with the multiple first holding portions, respectively, and a second connecting portion connecting</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CURRENT COLLECTORS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200401&amp;DB=EPODOC&amp;CC=TW&amp;NR=202013829A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200401&amp;DB=EPODOC&amp;CC=TW&amp;NR=202013829A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ABE, JUNICHI</creatorcontrib><creatorcontrib>NAKAO, HIROTO</creatorcontrib><title>Wiring fixing structure and processing apparatus</title><description>Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having through-holes penetrating in a plate thickness direction are arranged in parallel at predetermined intervals; a first insulation member including multiple first holding portions where convex portions that can be fitted into the through-holes are formed, a first connecting portion connecting the multiple first holding portions at the predetermined intervals, and leg portions extended from the first connecting portion to be parallel to the first holding portions and fixed to the metal surface; and a second insulation member including multiple second holding portions gripping and holding the conductor plates in cooperation with the multiple first holding portions, respectively, and a second connecting portion connecting</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIzyzKzEtXSMusAFHFJUWlySWlRakKiXkpCgVF-cmpxcUgicSCgsSixJLSYh4G1rTEnOJUXijNzaDo5hri7KGbWpAfn1pckJicmpdaEh8SbmRgZGBobGFk6WhMjBoAowAsCA</recordid><startdate>20200401</startdate><enddate>20200401</enddate><creator>ABE, JUNICHI</creator><creator>NAKAO, HIROTO</creator><scope>EVB</scope></search><sort><creationdate>20200401</creationdate><title>Wiring fixing structure and processing apparatus</title><author>ABE, JUNICHI ; NAKAO, HIROTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202013829A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ABE, JUNICHI</creatorcontrib><creatorcontrib>NAKAO, HIROTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ABE, JUNICHI</au><au>NAKAO, HIROTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wiring fixing structure and processing apparatus</title><date>2020-04-01</date><risdate>2020</risdate><abstract>Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having through-holes penetrating in a plate thickness direction are arranged in parallel at predetermined intervals; a first insulation member including multiple first holding portions where convex portions that can be fitted into the through-holes are formed, a first connecting portion connecting the multiple first holding portions at the predetermined intervals, and leg portions extended from the first connecting portion to be parallel to the first holding portions and fixed to the metal surface; and a second insulation member including multiple second holding portions gripping and holding the conductor plates in cooperation with the multiple first holding portions, respectively, and a second connecting portion connecting</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202013829A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
SEMICONDUCTOR DEVICES
title Wiring fixing structure and processing apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T07%3A10%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ABE,%20JUNICHI&rft.date=2020-04-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202013829A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true