Wiring fixing structure and processing apparatus

Provided is a technique for arranging and fixing wiring at a narrow pitch on a metal member or a dielectric member. A wiring fixing structure according to one aspect of the present disclosure comprises: a metal member having a metal surface; wiring in which a plurality of conductor plates having through-holes penetrating in a plate thickness direction are arranged in parallel at predetermined intervals; a first insulation member including multiple first holding portions where convex portions that can be fitted into the through-holes are formed, a first connecting portion connecting the multiple first holding portions at the predetermined intervals, and leg portions extended from the first connecting portion to be parallel to the first holding portions and fixed to the metal surface; and a second insulation member including multiple second holding portions gripping and holding the conductor plates in cooperation with the multiple first holding portions, respectively, and a second connecting portion connecting