Sensor package structure

The present invention provides a sensor package structure. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a ring-shaped support disposed on the sensor chip, a light permeable sheet disposed on the ring-shaped support, and an opaque package body formed on the substrate. A top surface of the sensor chip includes a sensing region, a spacing region arranged around the sensing region, and a carrying region arranged around the spacing region. The ring-shaped support is disposed on the carrying region. The light permeable sheet has a ring-shaped notch recessed in a surface thereof away from the substrate. The ring-shaped notch includes a step platform surface and a step wall surface connected to the step platform surface. At least part of the step platform surface is located above the ring-shaped support, and the step wall surface is located above the spacing region. A part of the opaque package body is filled in the ring-shaped notch, and is defined as a light shielding