Resin composition, and prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring substrate using same

An aspect of the present invention relates to a resin composition characterized by containing: (A) a polyphenylene ether compound having a group represented by formula (1) at a terminal end thereof; (B) (b-1) silica particles and a silane coupling agent having a functional group including a carbon-c...

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Bibliographische Detailangaben
Hauptverfasser: GOTO, HIROHISA, SAITO, HIROSUKE, NISHINO, MITSUYOSHI, ARISAWA, TATSUYA, SATOU, FUMINORI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:An aspect of the present invention relates to a resin composition characterized by containing: (A) a polyphenylene ether compound having a group represented by formula (1) at a terminal end thereof; (B) (b-1) silica particles and a silane coupling agent having a functional group including a carbon-carbon unsaturated double bond in the molecule thereof, and/or (b-2) silica particles surface-treated with the aforementioned silane coupling agent; and (C) an organic solvent, the pH of an extract obtained when a liquid mixture of component (A) and ion exchange water (pH = 5.0) mixed at a weight ratio of 1:3 is ultrasonically vibrated for 10 minutes at room temperature and then filter extracted being 5.0 or higher. [In formula (1), R1 represents a hydrogen atom or an alkyl group.].