Photosensitive resin composition, method for forming resist pattern, and method for manufacturing plated shaped body
The present invention is a photosensitive resin composition characterized by containing a polymerizable compound (A), a light radical polymerization initiator (B), a thiol compound (C), and a polymerization inhibitor (D), the content of the thiol compound (C) being 5-50 mass parts to 100 mass parts...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention is a photosensitive resin composition characterized by containing a polymerizable compound (A), a light radical polymerization initiator (B), a thiol compound (C), and a polymerization inhibitor (D), the content of the thiol compound (C) being 5-50 mass parts to 100 mass parts of the polymerizable compound (A), and the content of the polymerization inhibitor (D) being 1-10 mass parts to 100 mass parts of the polymerizable compound (A). The present invention makes it possible to provide a photosensitive resin composition having wide exposure latitude (EL) in both bright fields and dark fields. Using the photosensitive resin composition, it is possible to provide a method for forming a resist pattern with which it is possible to form a fine resist pattern having good accuracy in both bright fields and dark fields. Using a resist pattern formed using the method for forming a resist pattern, it is possible to provide a method for manufacturing a plated shaped body with which it is possible t |
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