Device surface renewal and rework by bundled laminate structures

A laminate structure is provided that allows the surface renewal and rework of a device by the selective removal of layers of the laminate. The selective removal may be achieved by heating or irradiating the laminate structure, such that an adhesive layer debonds and allows the removal of a damaged...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WEIDMAN, DAVID LEE, NATARAJAN, GOVINDARAJAN, BOOKBINDER, DANA CRAIG, WETMORE, NATHANIEL DAVID, JOUANNO, JEAN-MARC MARTIN GERARD
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A laminate structure is provided that allows the surface renewal and rework of a device by the selective removal of layers of the laminate. The selective removal may be achieved by heating or irradiating the laminate structure, such that an adhesive layer debonds and allows the removal of a damaged layer to provide a pristine surface.