Semiconductor packages and methods of forming the same

Semiconductor packages and methods of forming the same

Semiconductor packages and methods of forming the same are disclosed. A semiconductor package includes at least one die and a redistribution layer. The redistribution layer is disposed over and electrically to the at least one die and includes a seed layer structure and a metal feature over the seed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TSAI, HUI-JUNG, KUO, HUNG-JUI, PENG, JYUN-SIANG, PENG, CHIEN-TANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor packages and methods of forming the same are disclosed. A semiconductor package includes at least one die and a redistribution layer. The redistribution layer is disposed over and electrically to the at least one die and includes a seed layer structure and a metal feature over the seed layer structure. In some embodiments, an edge of the seed layer structure is protruded from an edge of the metal feature and has a surface roughness Rz greater than 10 nm.