Electronic device housing

An electronic device housing including a main body and a cover is provided. The main body has an opening. The cover is integrated with the main body by bi-injection with two or more kind of materials. The cover is capable of covering the opening. The main body has a first hardness while the cover ha...

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Bibliographische Detailangaben
Hauptverfasser:	HSU, HSIANGI, HSIEH, I-TIEN, KUO, CHAN-WEI, WANG, HUIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device housing including a main body and a cover is provided. The main body has an opening. The cover is integrated with the main body by bi-injection with two or more kind of materials. The cover is capable of covering the opening. The main body has a first hardness while the cover has a second hardness, wherein the first hardness is different from the second hardness.