Fabrication facility and method for fault detection in fabrication facility

The present disclosure provides a method for fault detection in a fabrication facility. The method includes moving a wafer into a processing tank, staying the wafer in the processing tank for a while, and removing the wafer from the processing tank. The method further includes emitting an acoustic e...

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Bibliographische Detailangaben
Hauptverfasser:	JUE, JA-SUMS, LIU, CHENG-WEI, CHAN, I-PIN, FAN, CHE-LUN, SU, YINGU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present disclosure provides a method for fault detection in a fabrication facility. The method includes moving a wafer into a processing tank, staying the wafer in the processing tank for a while, and removing the wafer from the processing tank. The method further includes emitting an acoustic energy into the processing tank and producing data associated with a measured acoustic energy according to the detected acoustic energy that is transmitted from the processing tank. The method also includes comparing the data associated with the measured acoustic energy and data associated with a desired acoustic energy and issuing a waning when there is a difference.