Semiconductor inspection apparatus and probe unit

Provided is a semiconductor inspection apparatus capable of performing high-speed response analysis for analysis of a failure in a microdevice constituting an LSI. In order to achieve this, the semiconductor inspection apparatus comprises: a vacuum chamber 3; a sample stand 4 which is disposed in the vacuum chamber and on which a sample 6 is placed; an electronic optical system 1 which is disposed so as to be able to irradiate the sample from above with an electron beam; a plurality of probe units 24 which are connected, via a coaxial cable 10, to external apparatuses 11, 12 disposed outside the vacuum chamber; and an electrode 5 which is disposed on or near the sample stand. The probe units 24 each include a measurement probe 8 which is brought into contact with the sample, a GND terminal 9 which is connected to the electrode 5, and a probe holder 7 which holds the measurement probe and the GND terminal, connects a signal wire of the coaxial cable to the measurement probe, and connects a GND wire of the coax