Aqueous dispersion for chemical mechanical polishing and method of producing the same

Aqueous dispersion for chemical mechanical polishing and method of producing the same

An aqueous dispersion for chemical mechanical polishing includes: (A) silica particles; (B) at least one kind selected from the group consisting of organic acids and salts thereof; and (C) at least one kind selected from the group consisting of amino group-containing silane compounds and condensates...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HIRAI, YUUJI, NAKANISHI, KOUJI, KUNITANI, EIICHIROU, OKAMOTO, MASASHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An aqueous dispersion for chemical mechanical polishing includes: (A) silica particles; (B) at least one kind selected from the group consisting of organic acids and salts thereof; and (C) at least one kind selected from the group consisting of amino group-containing silane compounds and condensates thereof, and has a pH of 7 or more and 14 or less.