Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the same. The epoxy resin composition includes: an epoxy resin; a curing agent; and a first inorganic filler including at least one type of metal particles selected from among copper,...

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Bibliographische Detailangaben
Hauptverfasser:	BAE, KYOUNGUL, KIM, MIN-SOO, LEE, JI HYE, PARK, YONG-YEOP, HONG, IL-GEUN, YOON, JI-AH, LEE, DONG-HWAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the same. The epoxy resin composition includes: an epoxy resin; a curing agent; and a first inorganic filler including at least one type of metal particles selected from among copper, nickel, aluminum, silver and gold particles coated with at least one selected from among silica and alumina.