Metrology apparatus and method for determining a characteristic relating to one or more structures on a substrate

Disclosed is a method of determining a characteristic of interest, in particular focus, relating to a structure on a substrate formed by a lithographic process, and an associated patterning device and lithographic system. The method comprises forming a modified substrate feature on the substrate usi...

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Bibliographische Detailangaben
Hauptverfasser: GUITTET, PIERRE-YVES JEROME YVAN, STEEN, STEVEN ERIK, VAN ADRI, PAULUS JACOBUS MARIA, STAALS, FRANK, GARCIA GRANDA, MIGUEL, BROUWER, ERIC JOS ANTON, SEGERS, BART PETER BERT
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Disclosed is a method of determining a characteristic of interest, in particular focus, relating to a structure on a substrate formed by a lithographic process, and an associated patterning device and lithographic system. The method comprises forming a modified substrate feature on the substrate using a corresponding modified reticle feature on a patterning device, the modified substrate feature being formed for a primary function other than metrology, more specifically for providing a support for a vertically integrated structure. The modified reticle feature is such that said modified substrate feature is formed with a geometry dependent on the characteristic of interest during formation. The modified substrate feature can be measured to determine said characteristic of interest.