Underfill material, semiconductor package, and method for producing semiconductor package

An underfill material includes an epoxy resin, a curing agent, and an inorganic filler, wherein a decrease ratio of a mass of a component obtained by subtracting a mass of the inorganic filler from a total mass of a cured product of the underfill material, after leaving the cured product for 1,000 h...

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Bibliographische Detailangaben
1. Verfasser:	SHIRAGAMI, MASASHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An underfill material includes an epoxy resin, a curing agent, and an inorganic filler, wherein a decrease ratio of a mass of a component obtained by subtracting a mass of the inorganic filler from a total mass of a cured product of the underfill material, after leaving the cured product for 1,000 hours at 175 DEG C, is 1.00% by mass or less.