Method of manufacturing semiconductor chip

Provided is a method of manufacturing a semiconductor chip that comprises the following steps (1) to (3) using an adhesive sheet which includes a base (Y) having an expandable base layer (Y1) containing expandable particles and a non-expandable base layer (Y2), and on respective sides of the base (Y), a first adhesive layer (X1) in which protrusions may form in the adhesive surface , due to the expansion of the expandable particles, and a second adhesive layer (X2). Step (1): A step of affixing the first adhesive layer (X1) to a hard support and affixing the second adhesive layer (X2) to the surface of a semiconductor wafer. Step (2): A step of obtaining a plurality of semiconductor chips. Step (3): A step of expanding the expandable particles and separating the hard support from the first adhesive layer (X1) at an interface P.