Sputtering method
A sputtering method of the invention uses a reactive sputtering apparatus, the reactive sputtering apparatus includes a cathode device that emits sputtered particles toward a formation region of a compound film to be formed on a film formation target object, a space facing the formation region is an...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A sputtering method of the invention uses a reactive sputtering apparatus, the reactive sputtering apparatus includes a cathode device that emits sputtered particles toward a formation region of a compound film to be formed on a film formation target object, a space facing the formation region is an opposed region, the cathode device includes: a scanning unit that scans an erosion region with the opposed region; and a target on which the erosion region is formed and which has a length in a scanning direction shorter than that of the opposed region, and the scanning unit scans the erosion region toward the opposed region from: a start position at which a midpoint of a surface of the target in the scanning direction is located outside the formation region in the scanning direction with respect to a first end portion of two end portions of the formation region in the scanning direction, at which the sputtered particles firstly reach; to an end position at which a midpoint of the surface of the target in the scan |
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