Negative photosensitive resin composition and method for producing cured relief pattern capable of obtaining a relatively high imidization rate and chemical resistance in low-temperature curing

The present invention provides a negative photosensitive resin composition capable of obtaining a relatively high imidization rate and chemical resistance in low-temperature curing, exhibiting a relatively high copper adhesion, and releasing less gas in a heating step after thermal curing, and also...

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Bibliographische Detailangaben
Hauptverfasser:	SHIOSAKI, SHUJIRO, OGURA, TOMOHITO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a negative photosensitive resin composition capable of obtaining a relatively high imidization rate and chemical resistance in low-temperature curing, exhibiting a relatively high copper adhesion, and releasing less gas in a heating step after thermal curing, and also provides a method for producing a cured relief pattern by using the negative photosensitive resin composition. The negative photosensitive resin composition of the present invention includes (A) a polyimide precursor, (B) an imide compound represented by the following general formula (1), and (C) a photo-polymerization initiator. In the formula (1), A1 is a group selected from the group consisting of a hydrogen atom, a hydroxyl group, and an amino group, and A2 is a divalent organic group having 1 to 20 carbon atoms.