Random copolymer compound, terminal-modified polymer compound and resin composition containing the same

An objective of this invention is to provide a random copolymer compound and terminal-modified polymer compound having excellent film-forming ability and high thermal-resistance and adhesive, also having low dielectric constant and dielectric tangent. The present invention relates to a random copoly...

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Bibliographische Detailangaben
Hauptverfasser:	AKATSUKA, YASUMASA, NAGASHIMA, NORIYUKI, SHIRAI, KAZUTERU, TANAKA, RYUTARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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