Random copolymer compound, terminal-modified polymer compound and resin composition containing the same

An objective of this invention is to provide a random copolymer compound and terminal-modified polymer compound having excellent film-forming ability and high thermal-resistance and adhesive, also having low dielectric constant and dielectric tangent. The present invention relates to a random copoly...

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Bibliographische Detailangaben
Hauptverfasser:	AKATSUKA, YASUMASA, NAGASHIMA, NORIYUKI, SHIRAI, KAZUTERU, TANAKA, RYUTARO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An objective of this invention is to provide a random copolymer compound and terminal-modified polymer compound having excellent film-forming ability and high thermal-resistance and adhesive, also having low dielectric constant and dielectric tangent. The present invention relates to a random copolymer compound containing (A) a polyphenylenic ether resin having phenolic hydroxyl group at the both ends, (B) an aliphatic polymer having alcoholic hydroxyl group at the both ends, and (C) binder, wherein, the molar number a of (A) the polyphenylenic ether resin, molar number b of (B) the aliphatic polymer, and molar number c of (C) binder satisfy the relationship of (a+b) > c.