Method for manufacturing multilayer wiring board

Provided is a method for manufacturing a multilayer wiring board, the method making it possible to extremely effectively prevent penetration of an inner layer circuit by laser processing while achieving excellent circuit adhesiveness. This method for manufacturing a multilayer wiring board comprises...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIKAWA, KAZUHIRO, MIZOGUCHI, MISATO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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